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Features
Long lifetime, good stability;
imported laser light source, very small spot size, special CCD monitoring;
High precision linear motion platform and the adjustable focusing apparatus;
Improved efficiency with automated image recognition processing;
High processing speed, low stress dicing and cutting, avoided of the debris, chipping and fracture caused by traditional cutting;
Simple processing, without blade, chemical liquid and other consumable;
No mechanical stress, high yeild in cutting crystal grain,
Electrical performance of diod chips is better than those cutting by wheel blade
High-resolution, high accuracy, automated assembly line operations
Applications
Suitable for dash cutting diode wafers, silicon wafer, IC wafers and semiconductor wafers, LED silicon wafers.
Used in glass, ceramics, quartz, diamond, boron nitrate and other transparent high-hardness and brittle wafer substrate, also used in copper, cobalt, steel, cobalt alloys, molybdenum and other metals. Mainly used in semiconductor, LED chip manufacturing and other high-tech industries.
LED Laser Cutting Machine for Semiconductor Wafers, Acrylic
